Description:
JCID 2nd-Gen Intelligent CNC Grinding Machine – JCID EM02 Automatic BGA Chip Grinder for iPhone 6-15 Pro Max Motherboard CPU IC SIM card slot grinding removal. JC EM02 Intelligent Grinding Machine for iPhone 6 7 8 X 11 12 13 14 15 series BGA Chip IC grinding removing. JCID EM02 CNC grinding machine is used to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone PCB without any damage in the board, motherboard hardware iCloud unlock tool.
JCID EM02 added iPhone 14-15 Series Card Slot Grinding Mould, which includes card slot grinding base and 8 sets of moulds for iPhone 14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max. JCID 14-15 series card slot grinding mould for grinding SIM
card slot on the middle frame of the iPhone 14-15 Pro Max.
Please Note:
1. Please place the iPhone mould with the "UP" side facing upward.
2. It’s necessary to use a blower to keep blowing air towards it when grinding.
3. The grinding time for iPhone 14/14 Plus/15/15 Plus is about 6 minutes.
4. The grinding time for iPhone 14Pro/14 Pro Max/15 Pro/15 Pro Max is about 14 minutes.
5. When the grinding machine reports that the pressure is too high during the grinding processing, the drill bit needs to be replaced to continue grinding.
Features:
For iPhone 6-15 Pro Max.
Support front and back Grinding (to reserve chip) for each model.
Self-developed operation system.
7-inch high-resolution capacitive touchscreen.
Support automatic software upgrade via WI-FI.
Chip grinding APP data will update automatically via WiF.
Grinding APP data for other accessories will update automatically for the future.
Adopt 1.2g Quad-Core CPU.
Integrated image processing chip.
Support 720P HD camera and 180-degree panoramic image display.
Supporting grinding for quadrangle chip, hexagonal WiFi chip and rounded parts.
Support chip data custom addiction.
Quickly generate accurate chip grinding data trough chip diagonal point. positioning Built-in precise sensor,
Fully automatic 5-point detection for the chip surface flatness,
Analysis and generation of surface grinding data.
3 axes all adopt imported ball screw and linear guide, processing accuracy no less than 0.01mm.
Support data import from USB memory.
Support connecting Mouse and Keyboard for operation.
1X JCID EM02 grinding machine.
1X Calibration Mould.
1X iPhone 11-11 Pro Max Front/Back grinding mold.
1X iPhone 12-12 Pro Max Front/Back grinding mold.
1X iPhone 13-13 Pro Max Front/Back grinding mold.
1X iPhone 14-14 Pro Max Front/Back grinding mold.
1X iPhone 15-15 Pro Max Front/Back grinding mold.
2X Wrench(13-15mm, 14-17mm).
10x PCB Drill bit(10pcs/box).
Added function EM02 CNC Mould(Optional):
1X iPhone 6-6P Front grinding mold.
1X iPhone 6-6SP Front grinding mold.
1X iPhone 6-6SP Back grinding mold(Resorve Chip).
1X iPhone 7-7P Front grinding mold.
1X iPhone 7-8P Back grinding mold(Resorve Chip).
1X CNC Machine Universal Fixture.
1X CPU mould+Vacumm pump.
1X Screen Bracket and Touch IC Grinding Mould.
1X iPhone 12-13 series Touch IC Grinding Mould.
1X iPhone 14 series touch IC grinding mold.
1X iPhone 13-13 Pro Max Front/Back grinding mold.
1X iPhone 14-14 Pro Max Front/Back grinding mold.
1X iPhone 15-15 Pro Max Front/Back grinding mold.
1x iPhone 14-15 Series Card Slot Grinding Mould.
1X Vacuum Cleaner.
1X Bit x 50PCS.
JCID EM02 added iPhone 14-15 Series Card Slot Grinding Mould,Β which includes card slot grinding base and 8 sets of moulds for iPhone 14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max. JCID 14-15 series card slot grinding mould for grinding SIM card slot on the middle frame of the iPhone 14-15 Pro Max.
JC EM02 grinding machine user manual:Β https://drive.google.com/file/d/1vE2AXT6VgHypSZxpT_xtwBq-ELEB7wAR/view?usp=drive_link
